1. 2. 3. material content data sheet sales product name sp370-25-106-0 issued 29. august 2013 ma# MA000979032 package pg-dsosp-14-64 weight* 620.40 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 28.549 4.60 4.60 46017 46017 leadframe inorganic material phosphorus 7723-14-0 0.044 0.01 71 non noble metal zinc 7440-66-6 0.176 0.03 283 non noble metal iron 7439-89-6 3.511 0.57 5660 non noble metal copper 7440-50-8 142.572 22.98 23.59 229805 235819 wire noble metal gold 7440-57-5 0.941 0.15 0.15 1517 1517 encapsulation organic material carbon black 1333-86-4 0.820 0.13 1322 plastics epoxy resin - 44.294 7.14 71395 inorganic material silicondioxide 60676-86-0 365.014 58.84 66.11 588349 661066 leadfinish non noble metal tin 7440-31-5 4.526 0.73 0.73 7295 7295 plating noble metal silver 7440-22-4 2.637 0.42 0.42 4250 4250 glue plastics maleimide resin - 5.464 0.88 8807 noble metal silver 7440-22-4 21.856 3.52 4.40 35229 44036 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
